- High precision and high efficiency (Cutting speed is 2 to 10 times faster than the loose abrasive type).
- Improved working environment (Water-soluble cutting fluid is usable).
- Environmentally friendly and able for recycling
- Cutting of sapphire, glass, quartz, and other brittle materials.
- Cutting of silicon for solar cell and semiconductor.
- Cutting of magnetic materials such as neodymium and ferrite magnets
- Cutting of SiC, various substrates and any special materials.